Facilities • Labs and Equipment
RIE & ICP
The RIE & ICP process (Reactive Ion Etching) is a dry etching process used in electronic and microelectronic manufacturing. Applications are for example fast and ultra high surface cleaning, surface activation, photo- resist stripping and semiconductor etching. The integrated turnkey systems are available in a variety of sizes and configurations, as well as custom systems. The RIE & ICP process combines the advantages of both technologies which provides high selectivity, high etching rate and isotropic etching. The RIE & ICP system and process is best suited for small lot production, pre production and prototyping and provides both cleaning of surface and/or activation of surfaces.
Features:
- High homogeneity and excellent reproducibility of the etch processes
- Computer controlled operation
- Data logging
- Through-the-wall installation
- Parallel plate reactor driven at 13.56 MHz (600 W)
- Automated and manual process control
- Recipe controlled etch processes
- Intelligent process control by jumps, loops, and calls in recipes
- Different access levels
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